Sam Shim | Principle Engineer, Memory Application Engineering Team
Samsung

Sam Shim is a Principal Engineer at Samsung Semiconductor with 19+ years of experience in enterprise infrastructure. He works at the Samsung Memory Application eXperience Lab (MAX Lab), helping organizations unlock the full potential of modern infrastructure through hands-on access to next-generation technologies in realistic, production-scale environments.

He has held roles at leading organizations including Hitachi Data Systems, IBM, EMC, Dell, Lenovo, and Samsung, spanning product management, business development, sales, and technical engineering.

Known for connecting the dots between technology and business value, Sam translates complex solutions into practical outcomes. He brings a balanced mix of deep technical expertise and commercial insight, and is recognized for being pragmatic, collaborative, and easy to work with.

Appearances:

Future of Memory and Storage - Day 3 @ 08:50

Beyond the Price Gap: Redefining Enterprise TCO with QLC Flash for Massively Distributed Object Storage

As QLC NAND densities reach 61TB and beyond, the storage industry is rapidly approaching a strategic crossover point with high-capacity HDDs. However, raw acquisition cost remains a significant hurdle for many enterprise users. This session presents a comprehensive joint study by Scality and the Samsung Memory Research Center (SMRC) introducing the "Performance TCO" (PTCO) model. We move beyond simplistic $/GB metrics by benchmarking real-world datasets across hundreds of diverse HDD platforms globally and comparing them directly against lab results obtained on SMRC QLC platforms. By examining 16KB cell alignment, Write Amplification Factor (WAF) in sequential SDS workloads, and high-throughput use cases like Veeam Backup & Replication targets, we illustrate how QLC is positioning itself as a vital economic and performance-driven alternative for modern high-density object storage environments.

Giorgio Regni, Co-Founder & CTO, Scality