Marius Draghia | CEO
RadioWires

Marius Draghia is a technology executive and inventor, and the Founder, CEO, and CTO of Radio Wires Inc., a company he established to solve one of the most critical bottlenecks in modern mobility and robotics: the "wiring nightmare."    
For over 25 years, Marius has pursued a singular passion: mastering the art and science of high-speed electrical signaling. His wide-ranging expertise spans the full spectrum of data transmission, from foundational baseband and broadband communications to advanced electro-optics, photonics, and wireless systems.  Throughout his career leading hardware design teams at prominent telecommunications firms like JDSU and Simbol Test Systems, he designed and validated the cutting-edge systems that form the backbone of our connected world.    
This deep, first-hand experience across multiple physical media gave him a unique perspective on the fundamental limitations of traditional wiring. He recognized that the complexity, weight, and reliance on centralized data switches were holding back the next generation of intelligent machines. This insight drove him to found RadioWires - not just to improve the existing system, but to replace it entirely.     As the principal inventor behind the company's patented "Multi-Tap Transmission Line" technology, Marius is leading the development of the RadioWires Tape™. This revolutionary product is the culmination of his life's work, replacing bulky, hand-assembled harnesses with a thin, self-adhesive printed tape that functions as a high-speed "nervous system" for vehicles and robots. By eliminating the central data switch, this technology enables faster development, improves reliability, and unlocks the full potential of Artificial Intelligence in the next generation of autonomous systems.     Marius's vision is to usher in a new era of manufacturing where the physical constraints of connectivity no longer limit innovation. He looks forward to connecting with fellow innovators and leaders at MOVE America to discuss the future of in-machine connectivity.