Yean Wei is the Director of Technical Business Development at Linxens Government. He joined Linxens in May 2010, leading the global R&D team in the smartcard components and ID document manufacturing before taking the role of technical BD in Jan 2024. Prior to joining Linxens, Yean Wei worked on radio frequency modules design in Fujitsu Media Devices and Satellite Research Center in Singapore.
To fight against counterfeiting and fraudulent attacks, new generation identity documents need to be protected by different levels of security features integrated with one another. Different levels mean that they must be overt, covert and forensic; but it also means that they must be visual, tactile and structural. The inner layers of an identity document (cards or passport) need to contribute effectively to guaranteeing the integrity and the authenticity of the document.
Recently, counterfeited documents have been intercepted with fake operating system, chip, and inlay (containing the RFID antenna). We know that counterfeiting masterminds exploit every weakness of an identity document. Today, an inlay that does not bring any additional security features is a potential weakness. Inlays need to include security features and/or structural specificities which will be combined to other level of security features and work harmoniously with the overall security design of the document. This presentation will illustrate different way to secure an ID document from its core to stay one step ahead of counterfeiters.